SEPP PSA

SEPP PSA was developed as a precision aluminum oxide specifically for sapphire machining (C-axis). The advantages over the use of conventional silica sol products lie in the increase of production rates in connection with decreasing production costs.

In addition, when using SEPP PSA, without changing the basic conditions, three times higher removal rates can be achieved.

Technical Data

grain size D10: 0.18µm
grain size D50: 0.25µm
grain size D90: 0.33µm
Solids: unter 15%
Crystalline structure: alpha
pH-value: 12,5
dilution: 1:2

Comparison Table

lapping process
600 grain		 polishing process
nach 30 minutes		 polishing process
nach 60 minutes		 polishing process
nach 90 minutes
silica sol
RR
1.97µm/ hour
SEPP PSA
RR
6.28µm/ hour